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IC KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray

KLMAG2GEND-B031

Model:KLMAG2GEND-B031

Manufacturer:SAMSUNG

Package:BGA

詳情

Product Descriptions


SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.


e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e?MMC supports 200MHz 

DDR – up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.


There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. 


Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.


The embedded flash management software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance.


Product Features


embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard

SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

 - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

                                      Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

 

 - Non-supported Features : Large Sector Size (4KB)

 

 Additional feature : HS400 mode (200MHz DDR - up to 400Mbps)

 

 Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems) 

 

Data bus width : 1bit (Default), 4bit and 8bit

 

MMC I/F Clock Frequency : 0 ~ 200MHz 

 

MMC I/F Boot Frequency : 0 ~ 52MHz 


Temperature : Operation (-25?C ~ 85?C), Storage without operation (-40?C ~ 85?C) 

 

Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)


Specifications


AttributeAttribute value
ANSM-Part#ANSM-KLMAG2GEND-B031
ECCN (US)3A991.b.1.a
Part StatusObsolete
AutomotiveNo
PPAPNo
Cell TypeMLC NAND
Chip Density (bit)128G
ArchitectureSectored
Boot BlockYes
Number of Bits/Word (bit)36989
Number of Words128G/32G/16G
ProgrammabilityYes
Timing TypeSynchronous
Maximum Erase Time (S)0.02
Interface TypeSerial e-MMC
Maximum Operating Frequency (MHz)200
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Temperature (°C)-25
Maximum Operating Temperature (°C)85
Command CompatibleYes
ECC SupportYes
Support of Page ModeNo
PackagingTape and Reel|Tray
MountingSurface Mount
Package Height0.48
Package Width11.5
Package Length13
PCB changed153
Standard Package NameBGA
Supplier PackageFBGA
Pin Count153
Lead ShapeBall


Actual product photos


KLMAG2GEND-B031


Product Data Book:



For more product information, please download the PDF


Payment&Transportation


詳情8.1


Official Certificate&Certificate



詳情頁3.1



Multiple product supply



詳情5.1


Company office environment


詳情6.1


Warehouse Real Shot


170019007688325e.png


Standard packaging


詳情9


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